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Mar 11, 2026

AI Memory History & Demand: NAND vs DRAM for Long Context Inference

Former Senior Fellow of Micron Technology and VP at Sandisk
Partner Interview
Micron Technology•US•Mega CapSandisk CorporationSK hynixNVIDIAIntelTSMCProcess PowerScale EconomiesSwitching CostsMission Critical Products & ServicesInformation Technology
Mar 9, 2026

KLA vs Applied Materials: Optical Inspection Competition & Architecture

Former General Manager at KLA
Partner Interview
KLA•US•Large CapApplied MaterialsLam ResearchASMLNVIDIATSMCProcess PowerSwitching CostsMission Critical Products & ServicesOEMs w/ Installed BaseInformation Technology
Mar 6, 2026

inTEST Corporation: Ambrell & Videology Moat & Unit Economics

Former President of inTEST Corporation
Partner Interview
inTEST•US•Small CapTSMCAdvantestTeradyneSwitching CostsProcess PowerMission Critical Products & ServicesInformation Technology
Mar 4, 2026

ASML & TSMC: Lithography Tool Ordering Process & Lead Time Management

Former Senior Executive at ASML
Partner Interview
ASML•NL•Mega CapTSMCNVIDIAIntelSamsung ElectronicsSK hynixSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer Discretionary
Mar 1, 2026

ASML: EUV Technology Evolution & China's 2035 Manufacturing Timeline

Former Senior Executive at ASML
Partner Interview
ASML•NL•Mega CapLam ResearchApplied MaterialsKLANVIDIASK hynixSamsung ElectronicsTSMCProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer Discretionary
Feb 5, 2026

ASM International: From Hafnium Oxide to 40+ ALD Layers at TSMC

Former Senior Director at ASM
Partner Interview
ASM International•NL•Large CapTSMCTokyo Electron LimitedApplied MaterialsIntelSwitching CostsProcess PowerMission Critical Products & ServicesInformation Technology
Jan 21, 2026

TSMC vs. Intel, Samsung & GlobalFoundries: How Fabless Customers Choose Foundries

Former Senior Vice President at Qualcomm
Partner Interview
TSMC•TW•Mega CapQualcommAppleGoogleAmazonNVIDIAAdvanced Micro DevicesBroadcomSamsung ElectronicsIntelSemiconductor Manufacturing InternationalGLOBALFOUNDRIESSwitching CostsProcess PowerBrand EquityNetwork EffectsScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsPhysical Infra & NetworksVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication Services
Jan 13, 2026

NVIDIA: Beyond the Wafer Constraints, Packaging, HBM & Testing

Former Senior Executive at Qualcomm
Partner Interview
NVIDIA•US•Mega CapQualcommTSMCIntelASMLAdvantestTeradyneASESK hynixSamsung ElectronicsBE Semiconductor IndustriesLam ResearchKLAGoogleAmazonProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BasePhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication Services
Jan 8, 2026

TSMC: Customer Contract Economics, Capacity & Yield

Former Senior Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapIntelMicron TechnologyNVIDIAASMLSamsung ElectronicsGLOBALFOUNDRIESUMC, Inc.Switching CostsProcess PowerScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryIndustrials
Jan 4, 2026

Amazon AWS and Anthropic: History of SageMaker & Bedrock AI

Former Generative AI Director at Amazon Web Services
Partner Interview
Amazon•US•Mega CapMicrosoftGoogleNVIDIAAdvanced Micro DevicesOpenAIAnthropicBroadcomMarvell TechnologyTSMCNetwork EffectsScale EconomiesSwitching CostsProcess PowerVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesConsumer DiscretionaryInformation TechnologyCommunication Services
Dec 28, 2025

Qualcomm, Apple, & High Performance Computing

Former Senior Executive at Qualcomm
Partner Interview
Qualcomm•US•Large CapTSMCBroadcomNVIDIAMicrosoftGoogleAmazonSamsung ElectronicsAppleMediaTekSwitching CostsProcess PowerNetwork EffectsScale EconomiesBrand EquityMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer Discretionary
Dec 19, 2025

Beyond CUDA: How TPUs and Trainium May Pressure NVIDIA

Former Chip Engineer at Google
Partner Interview
Microsoft•US•Mega CapGoogleAmazonNVIDIAOpenAIAdvanced Micro DevicesTSMCIntelQualcommMetaSwitching CostsNetwork EffectsScale EconomiesProcess PowerPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerMission Critical Products & ServicesInformation TechnologyCommunication ServicesConsumer Discretionary
Dec 16, 2025

BE Semiconductor: Adoption Timing and Constraints

Former Executive at BE Semiconductor
Partner Interview
BE Semiconductor Industries•NL•Large CapASMLTSMCSamsung ElectronicsKLAApplied MaterialsNXP SemiconductorsASM InternationalProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer Discretionary
Dec 15, 2025

BE Semiconductor: Mainstream vs Hybrid Bonding Growth Drivers

Former Commercial Executive at BE Semiconductor
Partner Interview
BE Semiconductor Industries•NL•Large CapTSMCSamsung ElectronicsASMLNXP SemiconductorsKLAApplied MaterialsASM InternationalSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer Discretionary
Dec 3, 2025

Besi & Hybrid Bonding’s Path to Scale: From Yield Bottlenecks to 2026–2030 Adoption

Former Director of Assembly at Intel
Partner Interview
BE Semiconductor Industries•NL•Large CapTSMCTaiwan Semiconductor Manufacturing Company LimitedAdvanced Micro DevicesNVIDIAAppleSamsung ElectronicsMicron TechnologyIntelSwitching CostsProcess PowerBrand EquityScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer Discretionary
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IP Research Resource
Dec 1, 2025

Raspberry Pi: Anatomy & Design of Single-Board Computers

IP Company Learning Journey
Raspberry Pi•GB•Small CapNVIDIAQualcommTSMCTaiwan Semiconductor Manufacturing Company LimitedNetwork EffectsProcess PowerSwitching CostsMission Critical Products & ServicesInformation Technology
Nov 26, 2025

TSMC: Pricing Power & Advanced Packaging

Former Director at TSMC
Partner Interview
TSMC•TW•Mega CapBroadcomNVIDIAAmazonMicrosoftGoogleIntelSamsung C&T CorporationSwitching CostsProcess PowerNetwork EffectsScale EconomiesMission Critical Products & ServicesVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryCommunication ServicesIndustrials
Nov 25, 2025

TSMC: Management Incentives, Yield, & Customer Relationships

Former Director at TSMC
Partner Interview
TSMC•TW•Mega CapIntelNVIDIAAdvanced Micro DevicesAmazonBroadcomMarvell TechnologyMicrosoftGoogleSwitching CostsProcess PowerNetwork EffectsScale EconomiesMission Critical Products & ServicesVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryCommunication Services
Nov 17, 2025

TSMC: Customer Switching Costs & Mature-Node Economics

Former VP of Foundry Operations and Technology at Analog Devices
Partner Interview
TSMC•TW•Mega CapIntelAnalog DevicesSamsung SDS Co.,Ltd.NVIDIAAppleUMC, Inc.Switching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryIndustrials
Oct 26, 2025

TSMC: Hybrid Bonding & Advanced Packaging Adoption and Bottlenecks

Former Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Manufacturing Company LimitedNVIDIAAdvanced Micro DevicesASMLSamsung ElectronicsAppleQualcommSK hynixBE Semiconductor IndustriesProcess PowerSwitching CostsBrand EquityMission Critical Products & ServicesOEMs w/ Installed BaseMarketplaces & PlatformsInformation TechnologyConsumer Discretionary

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