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Apr 24, 2026

Microsoft Azure: AI CapEx Strategy, GPU Economics & OpenAI Contract Structure

Partner Interview
MicrosoftUSMega CapOpenAIAnthropicCoreWeaveTSMCAmazonNVIDIAAdvanced Micro DevicesSwitching CostsProcess PowerNetwork EffectsScale EconomiesPhysical Infra & NetworksMission Critical Products & ServicesVertically Integrated RetailerInformation TechnologyConsumer Discretionary
Apr 23, 2026

Lam Research: TSMC Share Management & Market Position Strategy

Partner Interview
Lam ResearchUSMega CapKLATSMCASM InternationalTokyo ElectronProcess PowerSwitching CostsMission Critical Products & ServicesInformation Technology
Apr 20, 2026

Synopsys AI Strategy: DSO.ai, Workflow Agents & Generative RTL

Partner Interview
SynopsysUSLarge CapCadence Design SystemsTSMCSwitching CostsProcess PowerB2B SoftwareMission Critical Products & ServicesInformation Technology
Apr 10, 2026

Teradyne: AI Compute Test Strategy & Competing with Advantest

Partner Interview
TeradyneUSLarge CapTSMCAdvantestSwitching CostsProcess PowerMission Critical Products & ServicesInformation Technology
Apr 10, 2026

SK Hynix & NAND: Capex Triggers, Tool Selection & Vendor Lock-In

Partner Interview
SK hynixKRMega CapASMLLam ResearchApplied MaterialsKLATeradyneOnto InnovationTSMCON SemiconductorProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation Technology
Apr 5, 2026

Samsung, SK Hynix & Micron: HBM Packaging & Thermal Management Competition

Partner Interview
SK hynixKRMega CapTSMCMicron TechnologySamsung ElectronicsSwitching CostsProcess PowerScale EconomiesMission Critical Products & ServicesInformation TechnologyConsumer Discretionary
Apr 1, 2026

SK hynix, Micron & The DRAM Market: Capex Strategy and 80% Gross Margins

Partner Interview
SK hynixKRMega CapTSMCMicron TechnologySamsung ElectronicsApplied MaterialsAdvanced Micro DevicesSwitching CostsProcess PowerScale EconomiesMission Critical Products & ServicesInformation TechnologyConsumer Discretionary
Mar 11, 2026

AI Memory History & Demand: NAND vs DRAM for Long Context Inference

Partner Interview
Micron TechnologyUSMega CapSandisk CorporationSK hynixNVIDIAIntelTSMCProcess PowerScale EconomiesSwitching CostsMission Critical Products & ServicesInformation Technology
Mar 9, 2026

KLA vs Applied Materials: Optical Inspection Competition & Architecture

Partner Interview
KLAUSMega CapApplied MaterialsLam ResearchASMLNVIDIATSMCProcess PowerSwitching CostsMission Critical Products & ServicesOEMs w/ Installed BaseInformation Technology
Mar 6, 2026

inTEST Corporation: Ambrell & Videology Moat & Unit Economics

Partner Interview
inTESTUSSmall CapTSMCAdvantestTeradyneSwitching CostsProcess PowerMission Critical Products & ServicesInformation Technology
Mar 4, 2026

ASML & TSMC: Lithography Tool Ordering Process & Lead Time Management

Partner Interview
ASMLNLMega CapTSMCNVIDIAIntelSamsung ElectronicsSK hynixSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer Discretionary
Mar 1, 2026

ASML: EUV Technology Evolution & China's 2035 Manufacturing Timeline

Partner Interview
ASMLNLMega CapLam ResearchApplied MaterialsKLANVIDIASK hynixSamsung ElectronicsTSMCProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer Discretionary
Feb 5, 2026

ASM International: From Hafnium Oxide to 40+ ALD Layers at TSMC

Partner Interview
ASM InternationalNLLarge CapTSMCTokyo Electron LimitedApplied MaterialsIntelSwitching CostsProcess PowerMission Critical Products & ServicesInformation Technology
Jan 21, 2026

TSMC vs. Intel, Samsung & GlobalFoundries: How Fabless Customers Choose Foundries

Partner Interview
TSMCTWMega CapQualcommAppleGoogleAmazonNVIDIAAdvanced Micro DevicesBroadcomSamsung ElectronicsIntelSemiconductor Manufacturing InternationalGLOBALFOUNDRIESSwitching CostsProcess PowerBrand EquityNetwork EffectsScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsPhysical Infra & NetworksVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication Services
Jan 13, 2026

NVIDIA: Beyond the Wafer Constraints, Packaging, HBM & Testing

Partner Interview
NVIDIAUSMega CapQualcommTSMCIntelASMLAdvantestTeradyneASESK hynixSamsung ElectronicsBE Semiconductor IndustriesLam ResearchKLAGoogleAmazonProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BasePhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication Services
Jan 8, 2026

TSMC: Customer Contract Economics, Capacity & Yield

Partner Interview
TSMCTWMega CapIntelMicron TechnologyNVIDIAASMLSamsung ElectronicsGLOBALFOUNDRIESUMC, Inc.Switching CostsProcess PowerScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryIndustrials
Jan 4, 2026

Amazon AWS and Anthropic: History of SageMaker & Bedrock AI

Partner Interview
AmazonUSMega CapMicrosoftGoogleNVIDIAAdvanced Micro DevicesOpenAIAnthropicBroadcomMarvell TechnologyTSMCNetwork EffectsScale EconomiesSwitching CostsProcess PowerVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesConsumer DiscretionaryInformation TechnologyCommunication Services
Dec 28, 2025

Qualcomm, Apple, & High Performance Computing

Partner Interview
QualcommUSLarge CapTSMCBroadcomNVIDIAMicrosoftGoogleAmazonSamsung ElectronicsAppleMediaTekSwitching CostsProcess PowerNetwork EffectsScale EconomiesBrand EquityMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer Discretionary
Dec 19, 2025

Beyond CUDA: How TPUs and Trainium May Pressure NVIDIA

Partner Interview
MicrosoftUSMega CapGoogleAmazonNVIDIAOpenAIAdvanced Micro DevicesTSMCIntelQualcommMetaSwitching CostsNetwork EffectsScale EconomiesProcess PowerPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerMission Critical Products & ServicesInformation TechnologyCommunication ServicesConsumer Discretionary
Dec 16, 2025

BE Semiconductor: Adoption Timing and Constraints

Partner Interview
BE Semiconductor IndustriesNLLarge CapASMLTSMCSamsung ElectronicsKLAApplied MaterialsNXP SemiconductorsASM InternationalProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer Discretionary

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