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Lam Research: TSMC Share Management & Market Position Strategy

Partner Interview
Lam Research•US•Mega CapKLATSMCASM InternationalTokyo ElectronProcess PowerSwitching CostsMission Critical Products & ServicesInformation Technology
Apr 23, 2026

SK Hynix & NAND: Capex Triggers, Tool Selection & Vendor Lock-In

Partner Interview
SK hynix•KR•Mega CapASMLLam ResearchApplied MaterialsKLATeradyneOnto InnovationTSMCON SemiconductorProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation Technology
Apr 10, 2026

KLA Corporation: Service Contract Economics & Multi-Year Revenue Stability

Partner Interview
KLA•US•Mega CapLam ResearchApplied MaterialsASMLOnto InnovationProcess PowerSwitching CostsMission Critical Products & ServicesOEMs w/ Installed BaseInformation Technology
Apr 1, 2026

KLA Corporation: Process Control Intensity & Technology Inflections

Partner Interview
KLA•US•Mega CapASMLLam ResearchApplied MaterialsOnto InnovationProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation Technology
Mar 30, 2026
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Weekly update

Weekly Update: Markel Insurance, Lam Research, Adyen & Agentic Commerce

MarkelAdyenOnto InnovationVisaASMLKLAMastercardGoogleSap Se
Mar 26, 2026

Lam Research: AI Super Cycle Durability & Memory vs Logic Timing

Partner Interview
Lam Research•US•Mega CapASMLApplied MaterialsKLATeradyneOnto InnovationTokyo ElectronProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation Technology
Mar 18, 2026

Onto Innovation: Packaging Inspection Growth & HBM Ramp

Partner Interview
Onto Innovation•US•Large CapLam ResearchApplied MaterialsKLATeradyneProcess PowerSwitching CostsMission Critical Products & ServicesInformation Technology
Mar 17, 2026

KLA vs Applied Materials: Optical Inspection Competition & Architecture

Partner Interview
KLA•US•Mega CapApplied MaterialsLam ResearchASMLNVIDIATSMCProcess PowerSwitching CostsMission Critical Products & ServicesOEMs w/ Installed BaseInformation Technology
Mar 9, 2026

ASML: EUV Technology Evolution & China's 2035 Manufacturing Timeline

Partner Interview
ASML•NL•Mega CapLam ResearchApplied MaterialsKLANVIDIASK hynixSamsung ElectronicsTSMCProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer Discretionary
Mar 1, 2026

Applied Materials: Customer Concentration, Pricing Power & AI Cycle Drivers

Partner Interview
Applied Materials•US•Mega CapLam ResearchDoosanKLATokyo ElectronProcess PowerSwitching CostsMission Critical Products & ServicesInformation TechnologyIndustrials
Feb 25, 2026

Lam Research: Memory vs Logic Growth Drivers and Cycle Duration

Partner Interview
Lam Research•US•Mega CapASMLApplied MaterialsKLATeradyneOnto InnovationAmphenolProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation Technology
Feb 25, 2026

Onto vs KLA: Process Control Intensity in Advanced Packaging

Partner Interview
Onto Innovation•US•Large CapASMLLam ResearchApplied MaterialsKLATeradyneAmphenolProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation Technology
Feb 18, 2026

KLA Corporation: Process Control Intensity, Fab Ramp Dynamics & Competitive Positioning

Partner Interview
KLA•US•Mega CapLam ResearchApplied MaterialsCamtekASM InternationalProcess PowerSwitching CostsMission Critical Products & ServicesInformation Technology
Feb 9, 2026

TSMC, Samsung, Intel & Leading Edge Node Competition

Partner Interview
Taiwan Semiconductor Manufacturing Company Limited•TW•Mega CapSamsung ElectronicsKLAIntelNVIDIAGoogleProcess PowerSwitching CostsNetwork EffectsMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryCommunication Services
Jan 26, 2026

ASM International & Atomic Layer Deposition Competition

Partner Interview
ASM International•NL•Large CapSK hynixApplied MaterialsLam ResearchTokyo ElectronSamsung ElectronicsASMLKLAProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer Discretionary
Jan 20, 2026

NVIDIA: Beyond the Wafer Constraints, Packaging, HBM & Testing

Partner Interview
NVIDIA•US•Mega CapQualcommTSMCIntelASMLAdvantestTeradyneASESK hynixSamsung ElectronicsBE Semiconductor IndustriesLam ResearchKLAGoogleAmazonProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BasePhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication Services
Jan 13, 2026

BE Semiconductor: Adoption Timing and Constraints

Partner Interview
BE Semiconductor Industries•NL•Large CapASMLTSMCSamsung ElectronicsKLAApplied MaterialsNXP SemiconductorsASM InternationalProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer Discretionary
Dec 16, 2025

BE Semiconductor: Mainstream vs Hybrid Bonding Growth Drivers

Partner Interview
BE Semiconductor Industries•NL•Large CapTSMCSamsung ElectronicsASMLNXP SemiconductorsKLAApplied MaterialsASM InternationalSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer Discretionary
Dec 15, 2025

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