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Found 971 results in 13ms
Found 971 results in 13ms
Weekly update
Mar 9, 2026
Constellation Software, NVIDIA vs Google TPU, Salesforce, Honeywell Aerospace
HoneywellNVIDIAGoogleSalesforceAnthropicServiceNowMetaAdvanced Micro DevicesAirbusOpenAIAmazonHoneywellNVIDIAGoogleSalesforceAnthropicServiceNowMetaAdvanced Micro DevicesAirbusOpenAIAmazon
Weekly update
Mar 9, 2026
Constellation Software, NVIDIA vs Google TPU, Salesforce, Honeywell Aerospace
HoneywellNVIDIAGoogleSalesforceAnthropicServiceNowMetaAdvanced Micro DevicesAirbusOpenAIAmazonHoneywellNVIDIAGoogleSalesforceAnthropicServiceNowMetaAdvanced Micro DevicesAirbusOpenAIAmazon
Jan 21, 2026
TSMC vs. Intel, Samsung & GlobalFoundries: How Fabless Customers Choose Foundries
Former Senior Vice President at Qualcomm
Partner Interview
TSMC•TW•Mega CapQualcommAppleGoogleAmazonNVIDIAAdvanced Micro DevicesBroadcomSamsung ElectronicsIntelSemiconductor Manufacturing InternationalGLOBALFOUNDRIESSwitching CostsProcess PowerBrand EquityNetwork EffectsScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsPhysical Infra & NetworksVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication ServicesJan 20, 2026
NVIDIA vs Google TPU: Training Performance per $ per Watt
Former Data Center Product Architect and Senior Director at Nvidia
Partner Interview
NVIDIA•US•Mega CapAdvanced Micro DevicesGoogleAmazonMetaQualcommMicrosoftAnthropicOpenAIProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer DiscretionaryJan 6, 2026
Google: TPU & Broadcom Relationship
Former Chip Engineer at Google
Partner Interview
Google•US•Mega CapBroadcomMarvell TechnologyMicrosoftOpenAIAnthropicAmazonNVIDIAAdvanced Micro DevicesNetwork EffectsSwitching CostsScale EconomiesProcess PowerPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerMission Critical Products & ServicesCommunication ServicesInformation TechnologyConsumer DiscretionaryJan 4, 2026
Amazon AWS and Anthropic: History of SageMaker & Bedrock AI
Former Generative AI Director at Amazon Web Services
Partner Interview
Amazon•US•Mega CapMicrosoftGoogleNVIDIAAdvanced Micro DevicesOpenAIAnthropicBroadcomMarvell TechnologyTSMCNetwork EffectsScale EconomiesSwitching CostsProcess PowerVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesConsumer DiscretionaryInformation TechnologyCommunication ServicesJan 2, 2026
AWS re:Invent Takeaways: Trainium, Graviton 5, & Bedrock AI
Former Generative AI Director at Amazon Web Services
Partner Interview
Amazon•US•Mega CapAnthropicOpenAIMicrosoftGoogleNVIDIAAdvanced Micro DevicesNetwork EffectsScale EconomiesSwitching CostsProcess PowerVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesConsumer DiscretionaryInformation TechnologyCommunication ServicesDec 31, 2025
NVIDIA, Trainium, Claude Training & Inference Demand
Former Accelerated Computing Leader at AWS
Partner Interview
Google•US•Mega CapMicrosoftNVIDIAAdvanced Micro DevicesAnthropicOpenAIAmazonSwitching CostsNetwork EffectsProcess PowerScale EconomiesPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer DiscretionaryDec 30, 2025
AI Chips and LLM Compute: Nvidia, AMD, Google TPU, Amazon Trainium, and Emerging ASICs
Former Generative AI Director at Amazon Web Services
Partner Interview
Google•US•Mega CapMicrosoftOpenAIAmazonAdvanced Micro DevicesNVIDIAMetaSwitching CostsNetwork EffectsScale EconomiesProcess PowerPhysical Infra & NetworksVertically Integrated RetailerMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryCommunication ServicesDec 19, 2025
Beyond CUDA: How TPUs and Trainium May Pressure NVIDIA
Former Chip Engineer at Google
Partner Interview
Microsoft•US•Mega CapGoogleAmazonNVIDIAOpenAIAdvanced Micro DevicesTSMCIntelQualcommMetaSwitching CostsNetwork EffectsScale EconomiesProcess PowerPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerMission Critical Products & ServicesInformation TechnologyCommunication ServicesConsumer DiscretionaryDec 3, 2025
Besi & Hybrid Bonding’s Path to Scale: From Yield Bottlenecks to 2026–2030 Adoption
Former Director of Assembly at Intel
Partner Interview
BE Semiconductor Industries•NL•Large CapTSMCTaiwan Semiconductor Manufacturing Company LimitedAdvanced Micro DevicesNVIDIAAppleSamsung ElectronicsMicron TechnologyIntelSwitching CostsProcess PowerBrand EquityScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryNov 25, 2025
Amazon Web Services & AI GTM in Life Sciences
Former Global Life Sciences Sales Executive at Amazon Web Services
Partner Interview
Amazon•US•Mega CapNVIDIAGoogleMicrosoftBroadcomAdvanced Micro DevicesOpenAIOracleProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsB2B SoftwareInformation TechnologyConsumer DiscretionaryCommunication ServicesNov 25, 2025
TSMC: Management Incentives, Yield, & Customer Relationships
Former Director at TSMC
Partner Interview
TSMC•TW•Mega CapIntelNVIDIAAdvanced Micro DevicesAmazonBroadcomMarvell TechnologyMicrosoftGoogleSwitching CostsProcess PowerNetwork EffectsScale EconomiesMission Critical Products & ServicesVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryCommunication ServicesNov 25, 2025
SK Hynix, Micron, & Data Center HBM Demand
Former Vice President at Samsung Semiconductor
Partner Interview
SK hynix•KR•Mega CapMicron Solutions, Inc.NVIDIASamsung C&T CorporationAdvanced Micro DevicesBroadcomGoogleAmazonMetaMicrosoftProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyHealth CareIndustrialsCommunication ServicesConsumer DiscretionaryNov 24, 2025
Vistra Corp, Talen Energy, & US Data Center Power
Former Strategic Solutions Manager at Vistra Corp
Partner Interview
Vistra•US•Large CapTalen EnergyConstellation EnergyAmazonMicrosoftGoogleNVIDIABroadcomAdvanced Micro DevicesMetaNetwork EffectsScale EconomiesSwitching CostsProcess PowerVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesUtilitiesConsumer DiscretionaryInformation TechnologyCommunication ServicesNov 21, 2025
Hyperscaler AI Inference Cost: Custom ASICs vs GPUs
Former Data Center Product Architect and Senior Director at Nvidia
Partner Interview
NVIDIA•US•Mega CapMicrosoftGoogleAdvanced Micro DevicesBroadcomAmazonOpenAISwitching CostsNetwork EffectsProcess PowerScale EconomiesPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer DiscretionaryNov 20, 2025
NVIDIA Rack Architecture & Amphenol Positioning
Former Data Center Product Architect and Senior Director at Nvidia
Partner Interview
Amphenol•US•Large CapNVIDIAAdvanced Micro DevicesTE ConnectivityProcess PowerSwitching CostsMission Critical Products & ServicesInformation TechnologyNov 20, 2025
NVIDIA, Trainium, and GPUs vs Custom ASICs
Former Data Center Product Architect and Senior Director at Nvidia
Partner Interview
NVIDIA•US•Mega CapMicrosoftGoogleAdvanced Micro DevicesBroadcomAmazonOpenAISwitching CostsNetwork EffectsProcess PowerScale EconomiesPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer DiscretionaryNov 15, 2025
Semiconductor Manufacturing & Packaging: Hybrid Bonding
Former IBM Engineering Manager & GlobalFoundries Executive
Partner Interview
BE Semiconductor Industries•NL•Large CapTaiwan Semiconductor Manufacturing Company LimitedApplied MaterialsNVIDIAASMLIntelAdvanced Micro DevicesProcess PowerSwitching CostsMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyOct 26, 2025
TSMC: Hybrid Bonding & Advanced Packaging Adoption and Bottlenecks
Former Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Manufacturing Company LimitedNVIDIAAdvanced Micro DevicesASMLSamsung ElectronicsAppleQualcommSK hynixBE Semiconductor IndustriesProcess PowerSwitching CostsBrand EquityMission Critical Products & ServicesOEMs w/ Installed BaseMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryShowing 20 of 971 results