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Found 562 results in 9ms
Found 562 results in 9ms
Mar 4, 2026
ASML & TSMC: Lithography Tool Ordering Process & Lead Time Management
Former Senior Executive at ASML
Partner Interview
ASML•NL•Mega CapTSMCNVIDIAIntelSamsung ElectronicsSK hynixSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryMar 1, 2026
ASML: EUV Technology Evolution & China's 2035 Manufacturing Timeline
Former Senior Executive at ASML
Partner Interview
ASML•NL•Mega CapLam ResearchApplied MaterialsKLANVIDIASK hynixSamsung ElectronicsTSMCProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer DiscretionaryJan 26, 2026
TSMC, Samsung, Intel & Leading Edge Node Competition
Former Vice President at Samsung Semiconductor
Partner Interview
Taiwan Semiconductor Manufacturing Company Limited•TW•Mega CapSamsung ElectronicsKLAIntelNVIDIAGoogleProcess PowerSwitching CostsNetwork EffectsMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryCommunication ServicesJan 21, 2026
TSMC vs. Intel, Samsung & GlobalFoundries: How Fabless Customers Choose Foundries
Former Senior Vice President at Qualcomm
Partner Interview
TSMC•TW•Mega CapQualcommAppleGoogleAmazonNVIDIAAdvanced Micro DevicesBroadcomSamsung ElectronicsIntelSemiconductor Manufacturing InternationalGLOBALFOUNDRIESSwitching CostsProcess PowerBrand EquityNetwork EffectsScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsPhysical Infra & NetworksVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication ServicesJan 20, 2026
ASM International & Atomic Layer Deposition Competition
Former Director at ASM International
Partner Interview
ASM International•NL•Large CapSK hynixApplied MaterialsLam ResearchTokyo ElectronSamsung ElectronicsASMLKLAProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer DiscretionaryJan 13, 2026
NVIDIA: Beyond the Wafer Constraints, Packaging, HBM & Testing
Former Senior Executive at Qualcomm
Partner Interview
NVIDIA•US•Mega CapQualcommTSMCIntelASMLAdvantestTeradyneASESK hynixSamsung ElectronicsBE Semiconductor IndustriesLam ResearchKLAGoogleAmazonProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BasePhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication ServicesJan 8, 2026
TSMC: Customer Contract Economics, Capacity & Yield
Former Senior Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapIntelMicron TechnologyNVIDIAASMLSamsung ElectronicsGLOBALFOUNDRIESUMC, Inc.Switching CostsProcess PowerScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryIndustrialsDec 28, 2025
Qualcomm, Apple, & High Performance Computing
Former Senior Executive at Qualcomm
Partner Interview
Qualcomm•US•Large CapTSMCBroadcomNVIDIAMicrosoftGoogleAmazonSamsung ElectronicsAppleMediaTekSwitching CostsProcess PowerNetwork EffectsScale EconomiesBrand EquityMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer DiscretionaryDec 16, 2025
Thryv: SMB SaaS Pivot & Keap-Led Replatforming
Former Director of Product Marketing at Thryv
Partner Interview
Thryv•US•Small CapMicrosoftSamsung ElectronicsHubSpotStripeGoogleMetaSwitching CostsNetwork EffectsPhysical Infra & NetworksMarketplaces & PlatformsCommunication ServicesInformation TechnologyConsumer DiscretionaryDec 16, 2025
BE Semiconductor: Adoption Timing and Constraints
Former Executive at BE Semiconductor
Partner Interview
BE Semiconductor Industries•NL•Large CapASMLTSMCSamsung ElectronicsKLAApplied MaterialsNXP SemiconductorsASM InternationalProcess PowerSwitching CostsOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer DiscretionaryDec 15, 2025
BE Semiconductor: Mainstream vs Hybrid Bonding Growth Drivers
Former Commercial Executive at BE Semiconductor
Partner Interview
BE Semiconductor Industries•NL•Large CapTSMCSamsung ElectronicsASMLNXP SemiconductorsKLAApplied MaterialsASM InternationalSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryDec 3, 2025
Besi & Hybrid Bonding’s Path to Scale: From Yield Bottlenecks to 2026–2030 Adoption
Former Director of Assembly at Intel
Partner Interview
BE Semiconductor Industries•NL•Large CapTSMCTaiwan Semiconductor Manufacturing Company LimitedAdvanced Micro DevicesNVIDIAAppleSamsung ElectronicsMicron TechnologyIntelSwitching CostsProcess PowerBrand EquityScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryOct 26, 2025
TSMC: Hybrid Bonding & Advanced Packaging Adoption and Bottlenecks
Former Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Manufacturing Company LimitedNVIDIAAdvanced Micro DevicesASMLSamsung ElectronicsAppleQualcommSK hynixBE Semiconductor IndustriesProcess PowerSwitching CostsBrand EquityMission Critical Products & ServicesOEMs w/ Installed BaseMarketplaces & PlatformsInformation TechnologyConsumer DiscretionarySep 10, 2025
Apple, Meta, Google: Smart Glasses Competition
Former Prototype Development Manager at Apple
Partner Interview
Meta•US•Mega CapAppleGoogleMicrosoftSamsung ElectronicsNetwork EffectsSwitching CostsBrand EquityMarketplaces & PlatformsPhysical Infra & NetworksCommunication ServicesConsumer DiscretionaryInformation TechnologyAug 24, 2025
TSMC: Yield, PDK Discipline & Pricing Power
Former Engineer at AMD
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Manufacturing Company LimitedAdvanced Micro DevicesSamsung ElectronicsAppleAmazonInternational Business MachinesIntelNVIDIAMicrosoftQualcommASMLSwitching CostsProcess PowerBrand EquityNetwork EffectsScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsVertically Integrated RetailerPhysical Infra & NetworksOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryJul 30, 2025
TSMC & Semiconductor Manufacturing Moat
Former Senior Sourcing Manager at Apple
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Co., Ltd.AppleNVIDIASamsung ElectronicsIntelASMLSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryJul 8, 2025
TSMC: Photonics, Packaging, and Chinese Foundry Competition
Former VP at Micron Technology
Partner Interview
Micron TechnologyTSMCTaiwan Semiconductor Co., Ltd.Samsung ElectronicsIntelNVIDIAAppleBroadcomASMLMicron TechnologyTSMCTaiwan Semiconductor Co., Ltd.Samsung ElectronicsIntelNVIDIAAppleBroadcomASMLProcess PowerScale EconomiesSwitching CostsBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryJul 3, 2025
Synopsys: AI’s Intelligence Layer & EDA Moat Disruption
Former SVP at Synopsys
Partner Interview
SynopsysCadence Design SystemsNVIDIAAppleGoogleSiemensIntelAdvanced Micro DevicesMetaSamsung ElectronicsTSMCTaiwan Semiconductor Co., Ltd.BroadcomANSYSSynopsysCadence Design SystemsNVIDIAAppleGoogleSiemensIntelAdvanced Micro DevicesMetaSamsung ElectronicsTSMCTaiwan Semiconductor Co., Ltd.BroadcomANSYSSwitching CostsProcess PowerBrand EquityNetwork EffectsB2B SoftwareMission Critical Products & ServicesMarketplaces & PlatformsPhysical Infra & NetworksInformation TechnologyConsumer DiscretionaryCommunication ServicesIndustrialsJun 26, 2025
TSMC: Dominance in Leading-Edge Nodes
Former Senior Sourcing Manager at Apple
Partner Interview
TSMCAppleIntelNVIDIAQualcommSamsung ElectronicsASMLTSMCAppleIntelNVIDIAQualcommSamsung ElectronicsASMLSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryMay 9, 2025
The Trade Desk, Amazon & CTV Industry: Market Fragmentation Through Walled Garden Model
Former Senior Director at FreeWheel
Partner Interview
The Trade DeskSamsung ElectronicsRokuWalt DisneyNetflixGoogleAmazonThe Trade DeskSamsung ElectronicsRokuWalt DisneyNetflixGoogleAmazonNetwork EffectsBrand EquityCounter PositioningScale EconomiesSwitching CostsMarketplaces & PlatformsUnique IP & BrandsPhysical Infra & NetworksVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer DiscretionaryShowing 20 of 562 results