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Google's TPU Strategy: From Broadcom to MediaTek and Customer-Owned Tooling

Partner Interview
Google•US•Mega CapOpenAIAnthropicBroadcomNVIDIATaiwan Semiconductor Co., Ltd.AmazonMicrosoftMediaTekSwitching CostsPhysical Infra & Networks
Sep 14, 2026

Coherent vs Lumentum: Laser Fab Capacity & 800G to 1.6TB Transceiver Competition

Partner Interview
Coherent•USLumentumBroadcomNVIDIAProcess PowerMission Critical Products & Services
Jul 20, 2026

Marvell vs Broadcom: The 1.6T Optical DSP Market Share Battle

Partner Interview
Marvell Technology•US•Mega CapLumentumCoherentAnthropicOpenAIAstera LabsBroadcomGoogleMicrosoftAmazonNVIDIASwitching CostsPhysical Infra & Networks
Jun 8, 2026

Synopsys & Cadence: AlphaChip Recursive Intelligence Risk

Partner Interview
Cadence Design Systems•US•Large CapBroadcomGoogleSynopsysNetwork EffectsB2B Software
May 12, 2026

Broadcom & Google TPU: SerDes IP, Power Efficiency & Vertical Integration Strategy

Partner Interview
Google•US•Mega CapBroadcomNVIDIAMicrosoftMetaMediaTekAmazonNetwork EffectsPhysical Infra & Networks
Jan 31, 2026

TSMC vs. Intel, Samsung & GlobalFoundries: How Fabless Customers Choose Foundries

Partner Interview
TSMC•TW•Mega CapQualcommAppleGoogleAmazonNVIDIAAdvanced Micro DevicesBroadcomSamsung ElectronicsIntelSemiconductor Manufacturing InternationalGLOBALFOUNDRIESSwitching CostsMarketplaces & Platforms
Jan 21, 2026

Raspberry Pi: Customer Case Study

Partner Interview
Raspberry Pi•GB•Small CapQualcommBroadcomDellHP
Jan 20, 2026

Google: TPU & Broadcom Relationship

Partner Interview
Google•US•Mega CapBroadcomMarvell TechnologyMicrosoftOpenAIAnthropicAmazonNVIDIAAdvanced Micro DevicesSwitching CostsPhysical Infra & Networks
Jan 6, 2026

Amazon AWS and Anthropic: History of SageMaker & Bedrock AI

Partner Interview
Amazon•US•Mega CapMicrosoftGoogleNVIDIAAdvanced Micro DevicesOpenAIAnthropicBroadcomMarvell TechnologyTSMCSwitching CostsPhysical Infra & Networks
Jan 4, 2026

Qualcomm, Apple, & High Performance Computing

Partner Interview
Qualcomm•US•Large CapTSMCBroadcomNVIDIAMicrosoftGoogleAmazonSamsung ElectronicsAppleMediaTekSwitching CostsPhysical Infra & Networks
Dec 28, 2025

GCP, AWS: Vertical Integration & Leadership Culture

Partner Interview
Google•US•Mega CapAmazonMicrosoftOracleNVIDIAOpenAIBroadcomSwitching CostsPhysical Infra & Networks
Dec 5, 2025

AWS and Amazon Bedrock: AI Growth Strategy

Partner Interview
Amazon•US•Mega CapMicrosoftGoogleOracleNVIDIAOpenAIBroadcomSwitching CostsPhysical Infra & Networks
Nov 30, 2025

TSMC: Pricing Power & Advanced Packaging

Partner Interview
TSMC•TW•Mega CapBroadcomNVIDIAAmazonMicrosoftGoogleIntelSamsung C&T CorporationSwitching CostsPhysical Infra & Networks
Nov 26, 2025

Amazon Web Services & AI GTM in Life Sciences

Partner Interview
Amazon•US•Mega CapNVIDIAGoogleMicrosoftBroadcomAdvanced Micro DevicesOpenAIOracleSwitching CostsPhysical Infra & Networks
Nov 25, 2025

TSMC: Management Incentives, Yield, & Customer Relationships

Partner Interview
TSMC•TW•Mega CapIntelNVIDIAAdvanced Micro DevicesAmazonBroadcomMarvell TechnologyMicrosoftGoogleSwitching CostsPhysical Infra & Networks
Nov 25, 2025

SK Hynix, Micron, & Data Center HBM Demand

Partner Interview
SK hynix•KR•Mega CapMicron Solutions, Inc.NVIDIASamsung C&T CorporationAdvanced Micro DevicesBroadcomGoogleAmazonMetaMicrosoftNetwork EffectsPhysical Infra & Networks
Nov 25, 2025

Vistra Corp, Talen Energy, & US Data Center Power

Partner Interview
Vistra•US•Large CapTalen EnergyConstellation EnergyAmazonMicrosoftGoogleNVIDIABroadcomAdvanced Micro DevicesMetaNetwork EffectsPhysical Infra & Networks
Nov 24, 2025

Hyperscaler AI Inference Cost: Custom ASICs vs GPUs

Partner Interview
NVIDIA•US•Mega CapMicrosoftGoogleAdvanced Micro DevicesBroadcomAmazonOpenAISwitching CostsPhysical Infra & Networks
Nov 21, 2025

NVIDIA, Trainium, and GPUs vs Custom ASICs

Partner Interview
NVIDIA•US•Mega CapMicrosoftGoogleAdvanced Micro DevicesBroadcomAmazonOpenAISwitching CostsPhysical Infra & Networks
Nov 20, 2025

TSMC: Photonics, Packaging, and Chinese Foundry Competition

Partner Interview
Micron TechnologyTSMCTaiwan Semiconductor Co., Ltd.Samsung ElectronicsIntelNVIDIAAppleBroadcomASMLProcess PowerMission Critical Products & Services
Jul 8, 2025

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