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Found 111 results in 10ms
Found 111 results in 10ms
Feb 25, 2026
Lam Research: Memory vs Logic Growth Drivers and Cycle Duration
Former Senior Technical Director at Lam Research
Partner Interview
Lam Research•US•Mega CapASMLApplied MaterialsKLATeradyneOnto InnovationAmphenolSwitching CostsProcess PowerOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyFeb 18, 2026
Onto vs KLA: Process Control Intensity in Advanced Packaging
Former Vice President at Onto
Partner Interview
Onto Innovation•US•Large CapASMLLam ResearchApplied MaterialsKLATeradyneAmphenolSwitching CostsProcess PowerOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyFeb 16, 2026
ASM International: ALD Market Share Loss & Intrepid EPI Tool Challenges
Former Director of ASM International NV
Partner Interview
ASM International•NL•Large CapLam ResearchApplied MaterialsASMLSwitching CostsProcess PowerOEMs w/ Installed BaseInformation TechnologyJan 20, 2026
ASM International & Atomic Layer Deposition Competition
Former Director at ASM International
Partner Interview
ASM International•NL•Large CapSK hynixApplied MaterialsLam ResearchTokyo ElectronSamsung ElectronicsASMLKLASwitching CostsProcess PowerOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer DiscretionaryJan 13, 2026
NVIDIA: Beyond the Wafer Constraints, Packaging, HBM & Testing
Former Senior Executive at Qualcomm
Partner Interview
NVIDIA•US•Mega CapQualcommTSMCIntelASMLAdvantestTeradyneASESK hynixSamsung ElectronicsBE Semiconductor IndustriesLam ResearchKLAGoogleAmazonSwitching CostsProcess PowerNetwork EffectsScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BasePhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication ServicesJan 8, 2026
TSMC: Customer Contract Economics, Capacity & Yield
Former Senior Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapIntelMicron TechnologyNVIDIAASMLSamsung ElectronicsGLOBALFOUNDRIESUMC, Inc.Switching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryIndustrialsDec 16, 2025
BE Semiconductor: Adoption Timing and Constraints
Former Executive at BE Semiconductor
Partner Interview
BE Semiconductor Industries•NL•Large CapASMLTSMCSamsung ElectronicsKLAApplied MaterialsNXP SemiconductorsASM InternationalSwitching CostsProcess PowerOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyConsumer DiscretionaryDec 15, 2025
BE Semiconductor: Mainstream vs Hybrid Bonding Growth Drivers
Former Commercial Executive at BE Semiconductor
Partner Interview
BE Semiconductor Industries•NL•Large CapTSMCSamsung ElectronicsASMLNXP SemiconductorsKLAApplied MaterialsASM InternationalSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryNov 15, 2025
Semiconductor Manufacturing & Packaging: Hybrid Bonding
Former IBM Engineering Manager & GlobalFoundries Executive
Partner Interview
BE Semiconductor Industries•NL•Large CapTaiwan Semiconductor Manufacturing Company LimitedApplied MaterialsNVIDIAASMLIntelAdvanced Micro DevicesSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyOct 26, 2025
TSMC: Hybrid Bonding & Advanced Packaging Adoption and Bottlenecks
Former Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Manufacturing Company LimitedNVIDIAAdvanced Micro DevicesASMLSamsung ElectronicsAppleQualcommSK hynixBE Semiconductor IndustriesSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesOEMs w/ Installed BaseMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryOct 6, 2025
TSMC: Supply Over Price
Former Senior Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapQualcommGLOBALFOUNDRIESASMLNVIDIAMicron TechnologySK hynixAdvanced Micro DevicesIntelSwitching CostsProcess PowerMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyAug 24, 2025
TSMC: Yield, PDK Discipline & Pricing Power
Former Engineer at AMD
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Manufacturing Company LimitedAdvanced Micro DevicesSamsung ElectronicsAppleAmazonInternational Business MachinesIntelNVIDIAMicrosoftQualcommASMLSwitching CostsProcess PowerBrand EquityScale EconomiesNetwork EffectsMission Critical Products & ServicesMarketplaces & PlatformsVertically Integrated RetailerPhysical Infra & NetworksOEMs w/ Installed BaseInformation TechnologyConsumer Discretionary
Weekly update
Aug 6, 2025
H1 2025 - Most Viewed Interviews & IP Research
TSMCAmazonIAAFTAI AviationDriveTimeCarvanaCopartGE AerospaceDanaherSafranASMLThe AllstateFarfetchBridgecrestCettireGoogleKeringLVMHMcKessonMicrosoftIntelConstellation SoftwareWestlakeTSMCAmazonIAAFTAI AviationDriveTimeCarvanaCopartGE AerospaceDanaherSafranASMLThe AllstateFarfetchBridgecrestCettireGoogleKeringLVMHMcKessonMicrosoftIntelConstellation SoftwareWestlake
Jul 30, 2025
TSMC & Semiconductor Manufacturing Moat
Former Senior Sourcing Manager at Apple
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Co., Ltd.AppleNVIDIASamsung ElectronicsIntelASMLSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryJul 8, 2025
TSMC: Photonics, Packaging, and Chinese Foundry Competition
Former VP at Micron Technology
Partner Interview
Micron TechnologyTSMCTaiwan Semiconductor Co., Ltd.Samsung ElectronicsIntelNVIDIAAppleBroadcomASMLMicron TechnologyTSMCTaiwan Semiconductor Co., Ltd.Samsung ElectronicsIntelNVIDIAAppleBroadcomASMLSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryJun 26, 2025
TSMC: Dominance in Leading-Edge Nodes
Former Senior Sourcing Manager at Apple
Partner Interview
TSMCAppleIntelNVIDIAQualcommSamsung ElectronicsASMLTSMCAppleIntelNVIDIAQualcommSamsung ElectronicsASMLSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryJun 13, 2025
Synopsys, Cadence Design Systems: Business Model Defensibility
Former VP of R&D at Cadence Design Systems
Partner Interview
Cadence Design SystemsSynopsysANSYSMetaAppleNVIDIAASMLTSMCMicrosoftGoogleCadence Design SystemsSynopsysANSYSMetaAppleNVIDIAASMLTSMCMicrosoftGoogleSwitching CostsNetwork EffectsBrand EquityProcess PowerB2B SoftwareMarketplaces & PlatformsMission Critical Products & ServicesOEMs w/ Installed BasePhysical Infra & NetworksInformation TechnologyCommunication ServicesConsumer DiscretionaryMay 26, 2025
A TSMC Customer Perspective: Selecting a Foundry Partner
Former VP at Micron Technology
Partner Interview
IntelMicron TechnologyNVIDIAAppleASMLTSMCIntelMicron TechnologyNVIDIAAppleASMLTSMCSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryWeekly update
May 14, 2025
ASML & TSMC, Amazon Ads, BNSF vs Union Pacific, Nubank, DHR, Farfetch vs Cettire, QXO
AmazonTSMCFarfetchASMLCettireGoogleDanaherRichemontNVIDIALVMHAmazonTSMCFarfetchASMLCettireGoogleDanaherRichemontNVIDIALVMH
May 13, 2025
ASML & TSMC: Customer Relationship & Growth Outlook
Former Executive at ASML
Partner Interview
ASML•NL•Mega CapTSMCIntelSuper Micro ComputerNVIDIASwitching CostsProcess PowerOEMs w/ Installed BaseMission Critical Products & ServicesInformation TechnologyShowing 20 of 111 results