That's completely fine. Generally, do foundries prefer single sourcing or dual sourcing for these types of equipment? How is it usually handled, and what are the trade-offs?

Foundries typically prefer dual sourcing to have a backup and leverage over vendors, preventing dependency on a single supplier. That's usually the strategy for foundries. They need to evaluate their technology in advance, examining the equipment to see if it can easily scale to achieve even finer resolution. It's essential to consider how the equipment is designed and if it has forward-thinking capabilities. Can it be easily adjusted to a finer resolution? These are the aspects they need to check. As I mentioned for TSMC, there's a system on integrated chip hybrid bonding solution, SOIC. They are planning for five generations of SOIC, so they need to look at all the equipment vendors to ensure their technology and equipment is ready for all the generations.