TSMC: Hybrid Bonding & Advanced Packaging Adoption and Bottlenecks
Former Executive at Qualcomm
inpractise.com/articles/tsmc-hybrid-bonding-and-advanced-packaging-adoption-and-bottlenecks
TSMC: Hybrid Bonding & Advanced Packaging Adoption and Bottlenecks(October 26, 2025)
Former Executive at Qualcomm
Interview Transcript
This is a snippet of the transcript.Contact Salesto get full access.
That's completely fine. Generally, do foundries prefer single sourcing or dual sourcing for these types of equipment? How is it usually handled, and what are the trade-offs?
Foundries typically prefer dual sourcing to have a backup and leverage over vendors, preventing dependency on a single supplier. That's usually the strategy for foundries. They need to evaluate their technology in advance, examining the equipment to see if it can easily scale to achieve even finer resolution. It's essential to consider how the equipment is designed and if it has forward-thinking capabilities. Can it be easily adjusted to a finer resolution? These are the aspects they need to check. As I mentioned for TSMC, there's a system on integrated chip hybrid bonding solution, SOIC. They are planning for five generations of SOIC, so they need to look at all the equipment vendors to ensure their technology and equipment is ready for all the generations.
This is a snippet of the transcript.Contact Salesto get full access.
Related Content
Copyright Notice
This document may not be reproduced, distributed, or transmitted in any form or by any means including resale of any part, unauthorised distribution to a third party or other electronic methods, without the prior written permission of IP 1 Ltd.
IP 1 Ltd, trading as In Practise (herein referred to as "IP") is a company registered in England and Wales and is not a registered investment advisor or broker-dealer, and is not licensed nor qualified to provide investment advice.
In Practise reserves all copyright, intellectual and other property rights in the Content. The information published in this transcript (“Content”) is for information purposes only and should not be used as the sole basis for making any investment decision. Information provided by IP is to be used as an educational tool and nothing in this Content shall be construed as an offer, recommendation or solicitation regarding any financial product, service or management of investments or securities. The views of the executive expressed in the Content are those of the expert and they are not endorsed by, nor do they represent the opinion of In Practise. In Practise makes no representations and accepts no liability for the Content or for any errors, omissions, or inaccuracies will in no way be held liable for any potential or actual violations of laws, including without limitation any securities laws, based on Information sent to you by In Practise.
© 2025 IP 1 Ltd. All rights reserved.