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Found 15 results in 7ms
Found 15 results in 7ms
Dec 16, 2025
BE Semiconductor: Adoption Timing and Constraints
Former Executive at BE Semiconductor
Partner Interview
BE Semiconductor Industries•NL•Large CapASMLTSMCSamsung ElectronicsKLAApplied MaterialsNXP SemiconductorsASM International NVSwitching CostsProcess PowerMission Critical Products & ServicesInformation TechnologyConsumer DiscretionaryDec 15, 2025
BE Semiconductor: Mainstream vs Hybrid Bonding Growth Drivers
Former Commercial Executive at BE Semiconductor
Partner Interview
BE Semiconductor Industries•NL•Large CapTSMCSamsung ElectronicsASMLASM International NVNXP SemiconductorsKLAApplied MaterialsSwitching CostsProcess PowerMission Critical Products & ServicesInformation TechnologyConsumer DiscretionaryNov 15, 2025
Semiconductor Manufacturing & Packaging: Hybrid Bonding
Former IBM Engineering Manager & GlobalFoundries Executive
Partner Interview
BE Semiconductor Industries•NL•Large CapTaiwan Semiconductor Manufacturing Company LimitedApplied MaterialsNVIDIAASMLIntelAdvanced Micro DevicesSwitching CostsProcess PowerMission Critical Products & ServicesInformation TechnologyOct 26, 2025
TSMC: Hybrid Bonding & Advanced Packaging Adoption and Bottlenecks
Former Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Manufacturing Company LimitedNVIDIAAdvanced Micro DevicesASMLSamsung ElectronicsAppleQualcommSK hynixBE Semiconductor IndustriesSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryOct 6, 2025
TSMC: Supply Over Price
Former Senior Executive at Qualcomm
Partner Interview
TSMC•TW•Mega CapQualcommGLOBALFOUNDRIESASMLNVIDIAMicron TechnologySK hynixAdvanced Micro DevicesIntelSwitching CostsProcess PowerMission Critical Products & ServicesInformation TechnologyAug 24, 2025
TSMC: Yield, PDK Discipline & Pricing Power
Former Engineer at AMD
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Manufacturing Company LimitedAdvanced Micro DevicesSamsung ElectronicsAppleAmazonInternational Business MachinesIntelNVIDIAMicrosoftQualcommASMLSwitching CostsProcess PowerBrand EquityScale EconomiesNetwork EffectsMission Critical Products & ServicesMarketplaces & PlatformsVertically Integrated RetailerPhysical Infra & NetworksInformation TechnologyConsumer Discretionary
Weekly update
Aug 6, 2025
H1 2025 - Most Viewed Interviews & IP Research
TSMCAmazonIAAFTAI AviationDriveTimeCarvanaCopartGE AerospaceDanaherSafranASMLThe AllstateFarfetchBridgecrestCettireGoogleKeringLVMHMcKessonMicrosoftIntelConstellation SoftwareWestlakeTSMCAmazonIAAFTAI AviationDriveTimeCarvanaCopartGE AerospaceDanaherSafranASMLThe AllstateFarfetchBridgecrestCettireGoogleKeringLVMHMcKessonMicrosoftIntelConstellation SoftwareWestlake
Jul 30, 2025
TSMC & Semiconductor Manufacturing Moat
Former Senior Sourcing Manager at Apple
Partner Interview
TSMC•TW•Mega CapTaiwan Semiconductor Co., Ltd.AppleNVIDIASamsung ElectronicsIntelASMLSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryJul 8, 2025
TSMC: Photonics, Packaging, and Chinese Foundry Competition
Former VP at Micron Technology
Partner Interview
Micron TechnologyTSMCTaiwan Semiconductor Co., Ltd.Samsung ElectronicsIntelNVIDIAAppleBroadcomASMLMicron TechnologyTSMCTaiwan Semiconductor Co., Ltd.Samsung ElectronicsIntelNVIDIAAppleBroadcomASMLSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryJun 26, 2025
TSMC: Dominance in Leading-Edge Nodes
Former Senior Sourcing Manager at Apple
Partner Interview
TSMCAppleIntelNVIDIAQualcommSamsung ElectronicsASMLTSMCAppleIntelNVIDIAQualcommSamsung ElectronicsASMLSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryJun 13, 2025
Synopsys, Cadence Design Systems: Business Model Defensibility
Former VP of R&D at Cadence Design Systems
Partner Interview
Cadence Design SystemsSynopsysANSYSMetaAppleNVIDIAASMLTSMCMicrosoftGoogleCadence Design SystemsSynopsysANSYSMetaAppleNVIDIAASMLTSMCMicrosoftGoogleNetwork EffectsBrand EquitySwitching CostsProcess PowerMarketplaces & PlatformsMission Critical Products & ServicesPhysical Infra & NetworksInformation TechnologyCommunication ServicesConsumer DiscretionaryMay 26, 2025
A TSMC Customer Perspective: Selecting a Foundry Partner
Former VP at Micron Technology
Partner Interview
IntelMicron TechnologyNVIDIAAppleASMLTSMCIntelMicron TechnologyNVIDIAAppleASMLTSMCSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryWeekly update
May 14, 2025
ASML & TSMC, Amazon Ads, BNSF vs Union Pacific, Nubank, DHR, Farfetch vs Cettire, QXO
AmazonTSMCFarfetchASMLCettireGoogleDanaherRichemontNVIDIALVMHAmazonTSMCFarfetchASMLCettireGoogleDanaherRichemontNVIDIALVMH
May 13, 2025
ASML & TSMC: Customer Relationship & Growth Outlook
Former Executive at ASML
Partner Interview
ASMLTSMCIntelSuper Micro ComputerNVIDIAASMLTSMCIntelSuper Micro ComputerNVIDIASwitching CostsProcess PowerMission Critical Products & ServicesInformation TechnologyMar 10, 2025
ASML: Supply Chain Resilience & Supplier Agreements
Former Executive at ASML
Partner Interview
ASML•NL•Mega CapSamsung ElectronicsNVIDIAAppleSK hynixNikonCanonIntelTSMCBE Semiconductor IndustriesSwitching CostsProcess PowerBrand EquityMission Critical Products & ServicesMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryYou've reached the end