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Apr 24, 2026

Broadcom & Google TPU: SerDes IP, Power Efficiency & Vertical Integration Strategy

Partner Interview

Google•US•Mega CapBroadcomNVIDIAMicrosoftMetaMediaTekAmazonNetwork EffectsProcess PowerSwitching CostsScale EconomiesPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesVertically Integrated RetailerCommunication ServicesInformation TechnologyConsumer Discretionary

Jan 26, 2026

TSMC, Samsung, Intel & Leading Edge Node Competition

Partner Interview

Taiwan Semiconductor Manufacturing Company Limited•TW•Mega CapSamsung ElectronicsKLAIntelNVIDIAGoogleProcess PowerSwitching CostsNetwork EffectsMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsInformation TechnologyConsumer DiscretionaryCommunication Services

Jan 22, 2026

Synopsys, Ansys, and Chiplets: Backend EDA and Interface IP Demand

Partner Interview

Synopsys•US•Large CapCadence Design SystemsNVIDIAIntelArmInternational Business MachinesANSYSSwitching CostsProcess PowerB2B SoftwareMission Critical Products & ServicesInformation Technology

Jan 21, 2026

TSMC vs. Intel, Samsung & GlobalFoundries: How Fabless Customers Choose Foundries

Partner Interview

TSMC•TW•Mega CapQualcommAppleGoogleAmazonNVIDIAAdvanced Micro DevicesBroadcomSamsung ElectronicsIntelSemiconductor Manufacturing InternationalGLOBALFOUNDRIESSwitching CostsProcess PowerBrand EquityNetwork EffectsScale EconomiesMission Critical Products & ServicesMarketplaces & PlatformsPhysical Infra & NetworksVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication Services

Jan 20, 2026

NVIDIA vs Google TPU: Training Performance per $ per Watt

Partner Interview

NVIDIA•US•Mega CapAdvanced Micro DevicesGoogleAmazonMetaQualcommMicrosoftAnthropicOpenAIProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyCommunication ServicesConsumer Discretionary

Jan 13, 2026

NVIDIA: Beyond the Wafer Constraints, Packaging, HBM & Testing

Partner Interview

NVIDIA•US•Mega CapQualcommTSMCIntelASMLAdvantestTeradyneASESK hynixSamsung ElectronicsBE Semiconductor IndustriesLam ResearchKLAGoogleAmazonProcess PowerSwitching CostsNetwork EffectsScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BasePhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerInformation TechnologyConsumer DiscretionaryCommunication Services

Jan 8, 2026

TSMC: Customer Contract Economics, Capacity & Yield

Partner Interview

TSMC•TW•Mega CapIntelMicron TechnologyNVIDIAASMLSamsung ElectronicsGLOBALFOUNDRIESUMC, Inc.Switching CostsProcess PowerScale EconomiesMission Critical Products & ServicesOEMs w/ Installed BaseInformation TechnologyConsumer DiscretionaryIndustrials

Jan 6, 2026

Google: TPU & Broadcom Relationship

Partner Interview

Google•US•Mega CapBroadcomMarvell TechnologyMicrosoftOpenAIAnthropicAmazonNVIDIAAdvanced Micro DevicesNetwork EffectsSwitching CostsScale EconomiesProcess PowerPhysical Infra & NetworksMarketplaces & PlatformsVertically Integrated RetailerMission Critical Products & ServicesCommunication ServicesInformation TechnologyConsumer Discretionary

Jan 4, 2026

Amazon AWS and Anthropic: History of SageMaker & Bedrock AI

Partner Interview

Amazon•US•Mega CapMicrosoftGoogleNVIDIAAdvanced Micro DevicesOpenAIAnthropicBroadcomMarvell TechnologyTSMCNetwork EffectsScale EconomiesSwitching CostsProcess PowerVertically Integrated RetailerPhysical Infra & NetworksMarketplaces & PlatformsMission Critical Products & ServicesConsumer DiscretionaryInformation TechnologyCommunication Services

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Microsoft Azure: AI CapEx Strategy, GPU Economics & OpenAI Contract Structure

HBM, DRAM & NAND: Memory Hierarchy for AI Workloads

MPS vs ADI vs TI: Power Management Competition & DrMOS Pricing Pressure

AI Memory History & Demand: NAND vs DRAM for Long Context Inference

KLA vs Applied Materials: Optical Inspection Competition & Architecture

Constellation Software, NVIDIA vs Google TPU, Salesforce, Honeywell Aerospace

ASML & TSMC: Lithography Tool Ordering Process & Lead Time Management

ASML: EUV Technology Evolution & China's 2035 Manufacturing Timeline

Raspberry Pi: Company Culture & Leadership

Raspberry Pi: A Customer's Perspective

Raspberry Pi: Ecosystem Partner's Perspective

Broadcom & Google TPU: SerDes IP, Power Efficiency & Vertical Integration Strategy

TSMC, Samsung, Intel & Leading Edge Node Competition

Synopsys, Ansys, and Chiplets: Backend EDA and Interface IP Demand

TSMC vs. Intel, Samsung & GlobalFoundries: How Fabless Customers Choose Foundries

NVIDIA vs Google TPU: Training Performance per $ per Watt

NVIDIA: Beyond the Wafer Constraints, Packaging, HBM & Testing

TSMC: Customer Contract Economics, Capacity & Yield

Google: TPU & Broadcom Relationship

Amazon AWS and Anthropic: History of SageMaker & Bedrock AI